January 27, 2026
Finance

Broadcom Expected to Command Majority of Custom AI Chip Market by 2027

Counterpoint Research Highlights Expansion and Shifts in AI Server Compute ASIC Deployments Among Hyperscalers

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Summary

The market for custom AI server compute chips is rapidly expanding as hyperscale cloud and AI providers intensify deployment of internally designed silicon. Leading hyperscalers including Google, Amazon Web Services, Microsoft, Meta, and Apple are investing heavily in AI-specific ASICs to meet growing demands for specialized training and inference tasks. Broadcom is forecasted to maintain a dominant position with a 60% market share by 2027, despite rising competition from industry alliances such as Google and MediaTek. Taiwan Semiconductor Manufacturing Company continues to lead as the primary foundry for AI ASIC fabrication.

Key Points

Broadcom is projected to control roughly 60% of the custom AI server compute ASIC market by 2027, maintaining its leadership position despite increasing competition.
AI server compute ASIC shipments among top hyperscalers are expected to triple from 2024 to 2027, driven by growing internal chip deployments from Google, AWS, Meta, Microsoft, and others.
Google’s TPU infrastructure remains the core component of AI server compute volumes, supporting demand from its Gemini AI models and sustaining internal silicon investment.
The market is shifting from a duopoly dominated by Google and AWS toward a more diversified distribution by 2027, with significant contributions from Meta and Microsoft’s expanding chip programs.

The demand for custom AI Application-Specific Integrated Circuits (ASICs) is intensifying as major hyperscale cloud and AI companies accelerate the development and deployment of internal silicon solutions tailored for AI workloads. According to Counterpoint Research, this escalation is primarily driven by the need for highly specialized chips capable of efficiently managing the significant computational requirements of modern AI training and inference.

Prominent technology giants leading these efforts include Alphabet Inc.’s Google, known by its ticker GOOGL; Amazon Web Services (AWS) under Amazon.com, Inc. (AMZN); Microsoft Corporation (MSFT); OpenAI; ByteDance; and Apple Inc. (AAPL). These companies are actively scaling their proprietary AI server compute ASIC systems, moving away from traditional merchant GPU reliance to better optimize power efficiency and compute performance specific to AI workloads.

Counterpoint Research projects a substantial growth trajectory for AI server compute ASIC shipments among the top ten hyperscalers, anticipating a tripling in volume between 2024 and 2027. This surge is underpinned by multiple key factors:

  • Google’s continued scaling of its Tensor Processing Unit (TPU) infrastructure, which provides the computational backbone for the Gemini AI model.
  • AWS's expansion of Trainium clusters, representing Amazon’s custom-designed chips for machine learning training.
  • Volume ramp-ups from Meta Platforms Inc.’s (META) MTIA chips.
  • Microsoft's deployment of Maia chips as part of their internal silicon portfolio growth.

Within this evolving landscape, Broadcom Inc. (AVGO) is positioned as the premier AI server compute ASIC design partner. Counterpoint forecasts that Broadcom will secure approximately 60% of the market share by 2027. This level of dominance persists despite intensifying rivalry, notably from the emerging partnership between Google and MediaTek, which is gaining traction in internal chip design services.

Conversely, Marvell Technology Inc. (MRVL), another notable ASIC design provider, is predicted to experience pressure on its design-win pipeline. Although its shipment volumes are expected to double over the forecast period, its market share in design services is anticipated to decline to roughly 8% by 2027, reflecting shifts in strategic partnerships and client preferences among hyperscalers.

Google's TPU infrastructure remains a foundational element of AI computational capacity across the industry. Counterpoint identifies the TPU fleet as the anchor for AI server compute ASIC volumes, largely due to the intensive demands of training and serving Google’s next-generation Gemini models. Despite a potential softening of Google's market share as the overall addressable market broadens and competitors scale their offerings, TPUs are expected to maintain a central role in AI compute deployments.

The AI server compute ASIC sector is undergoing structural transformation. While historically concentrated within a duopoly—dominated by Google and AWS as of 2024—the sector is moving toward a more diversified environment by 2027. Counterpoint highlights increased contributions from Meta and Microsoft, who are accelerating the pace and scale of their internal chip programs. This diversification underscores a broader hyperscaler strategy focused on minimizing dependency on merchant GPUs while enhancing computing efficiency and power consumption profiles through custom silicon adapted to specific workload demands.

In terms of manufacturing, Taiwan Semiconductor Manufacturing Company Limited (TSMC) continues to dominate as the foundry of choice for AI server compute ASICs. TSMC accounts for nearly the entirety of wafer fabrication among the top 10 players across both front-end and most back-end manufacturing processes. This entrenched position reflects TSMC’s technological expertise and capacity to meet the stringent production requirements of advanced AI silicon chips.

Market performance reflects these developments. Broadcom’s stock is exhibiting positive momentum, aligning with its projected leadership in AI ASIC design services. Share price movements among key players such as Apple, Amazon, Alphabet, Meta, Marvell, Microsoft, and TSMC also mirror industry expectations surrounding their respective roles in this expanding AI compute ecosystem.

Risks
  • Competitive pressures from emerging alliances such as Google–MediaTek could challenge Broadcom’s market share dominance despite its strong position.
  • Marvell Technology faces design-win headwinds, potentially reducing its share of design services even as shipment volumes grow.
  • Expansion of the custom AI ASIC market depends on sustained demand from hyperscalers for proprietary silicon, which may be affected by technological or strategic shifts.
  • Taiwan Semiconductor Manufacturing Company’s continued dominance as the foundry may present supply chain risks if capacity constraints or disruptions occur.
Disclosure
Education only / not financial advice
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