Samsung Electronics Co. Ltd. has significantly increased its commitment to next-generation semiconductor manufacturing, targeting the growing global appetite for high-performance chips used in artificial intelligence (AI) workloads. The South Korean technology giant is directing substantial resources toward improving production yield control as it strives to establish leadership in advanced foundry technologies.
A key component of Samsung’s strategy involves strategic investments in metrology startups, companies that develop measurement and analysis tools critical to semiconductor fabrication precision. Samsung recently acquired a stake in Invisix, a metrology firm founded by former executives from ASML Holding NV, a leader in lithography equipment design. According to reports from Korean financial media, this partnership is positioned to enhance yield performance specifically at the company's 2-nanometer (2 nm) process node.
In addition to its involvement with Invisix, Samsung has also increased its holdings in FemtoMetrix, a U.S.-based chip metrology startup. This investment is part of Samsung’s effort to bolster its competitive edge against dominant foundry rival Taiwan Semiconductor Manufacturing Co. (TSMC) by advancing precision in production controls and improving fabrication outcomes.
Significance of the 2-Nanometer Node
The 2 nm process represents a significant technological leap in semiconductor design. This node leverages Gate-All-Around (GAA) nanosheet transistor architecture, a technology that surpasses the limitations of the previously dominant FinFET transistors. The shift to GAA technology at the 2 nm scale aims to offer markedly improved performance characteristics, including enhanced speed and reduced power consumption when compared to chips built on 3 nm and 7 nm nodes.
This evolution is critical for applications that require accelerated data processing speeds combined with energy efficiency, such as AI, machine learning, and other high-performance computing scenarios.
Competitive Landscape: Taiwan Semiconductor’s Advances
Samsung’s enhancements in manufacturing come as rival Taiwan Semiconductor deepens its foothold in 2 nm chip production. TSMC announced that it had initiated volume manufacturing of chips using its first-generation nanosheet transistor design at its Fab 22 facility in Kaohsiung, Taiwan, with mass production slated to begin in the fourth quarter of 2025.
Looking forward, TSMC is actively developing an improved iteration of its 2 nm process, referred to as N2P, which is intended to deliver better form factor, performance, and power metrics. Mass volume production of N2P is expected in the latter half of 2026.
To accommodate rising demand fueled by AI advancements, TSMC is significantly ramping its 2 nm capacity. High-profile clients such as Apple Inc. and Nvidia Corp. are already securing substantial portions of TSMC's most advanced semiconductor manufacturing capacities, underscoring strong market demand for the latest chip fabrication technologies.
Market Activity and Stock Performance
Shares of Taiwan Semiconductor were reported to have risen by 0.33% to $336.86 during premarket trading recently, nearing their 52-week high of $351.33. The stock's steady performance reflects investor confidence amid the company's aggressive technology development and capacity expansion strategies.
Meanwhile, Samsung's public equity position remains of interest to market observers, noting its ongoing strategy of scaling investments to compete in the ever-evolving semiconductor industry.
Conclusion
Samsung’s focus on improving advanced foundry yields through investment in specialized metrology startups aligns with its broader goal to enhance competitiveness in high-end semiconductor production. As the semiconductor market increasingly prioritizes 2 nm process technology to meet AI and HPC demands, both Samsung and its key competitor TSMC are accelerating respective strategies and production ramp-ups to secure leadership in this critical segment.